| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device containing a passive component, which achieves easy packaging design and high reliability, and which is densely packed into packages without causing cost increase. <P>SOLUTION: A semiconductor device 101 comprises: a circuit board 2; passive components 4 arranged on the circuit board 2; a semiconductor chip 1 arranged on the circuit board 2 so as to cover the passive components 4 and electrically connected with the circuit board 2 via bonding wires 6; and a coating resin 3 coating the semiconductor chip 1 and the passive components 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
