| 摘要 |
<P>PROBLEM TO BE SOLVED: To accurately calculate a grinding amount of a resin layer without being influenced by a thickness variation of piezoelectric substrates and a protective tape while eliminating worker's handwork, and to automate a process from calculating the grinding amount of the resin layer to a grinding operation, in grinding the resin layer of a wafer used for a SAW device into a certain thickness. <P>SOLUTION: Before grinding the resin layer 6 of the wafer 1 used for the SAW device, near-infrared light L is radiated from a head 61 to the resin layer 6 with at least water made not to exist in a space formed between the head 61 of a near-infrared light radiating means 62 and the resin layer 6, and thereby the thickness of the resin layer 6 is calculated from an interference wave of reflected light reflected on a surface 6a of the resin layer 6 and a surface 2a of a substrate 2 to determine a required grinding amount of the resin layer 6 for each wafer 1. The thickness of the resin layer 6 formed of a resin having a refractive index approximate to that of water is calculated without being influenced by water, thus obtaining a measured value of the accurate thickness of the resin layer 6 for each wafer 1 before grinding the wafer 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
