发明名称 RESIN FILM FORMING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin film forming apparatus which decreases the cost of forming a resin film by minimizing waste liquid resin. <P>SOLUTION: The resin film forming apparatus (2) includes a table (22) for film formation which is equipped with an annular convex portion (65) so as to surround a suction surface (61) retaining a wafer (W) and a coating section (23) which forms a liquid-tight space (S) above the wafer (W) by touching the annular convex portion (65) of the table (22) for film formation. The coating section (23) has a supply port (74) for supplying the liquid-tight space with liquid resin and a suction groove (76) which sucks the inside of the liquid-tight space (S) in a position opposite to the outer peripheral side of the wafer (W), and the table (22) for film formation and the coating section (23) are designed to slide relatively. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013103396(A) 申请公布日期 2013.05.30
申请号 JP20110248254 申请日期 2011.11.14
申请人 DISCO CORP 发明人 FUNO TOMOHIRO
分类号 B29C39/10;B05C5/00;B05C11/10;B05C13/02;H01L21/301 主分类号 B29C39/10
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