发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 A semiconductor device which eliminates the need for high fillability through a simple process and a method for manufacturing the same. A high breakdown voltage lateral MOS transistor including a source region and a drain region is completed on a surface of a semiconductor substrate. A trench which surrounds the transistor when seen in a plan view is made in the surface of the semiconductor substrate. An insulating film is formed over the transistor and in the trench so as to cover the transistor and form an air-gap space in the trench. Contact holes which reach the source region and drain region of the transistor respectively are made in an interlayer insulating film.
申请公布号 US2013134549(A1) 申请公布日期 2013.05.30
申请号 US201213725389 申请日期 2012.12.21
申请人 RENESAS ELECTRONICS CORPORATION;RENESAS ELECTRONICS CORPORATION 发明人 ONISHI KAZUMA;OTSU YOSHITAKA;KIMURA HIROSHI;NITTA TETSUYA;YANAGI SHINICHIRO;MORII KATSUMI
分类号 H01L29/06 主分类号 H01L29/06
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