| 发明名称 |
SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE SAME |
| 摘要 |
Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.
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| 申请公布号 |
US2013134208(A1) |
申请公布日期 |
2013.05.30 |
| 申请号 |
US201213675235 |
申请日期 |
2012.11.13 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MUKAI NORIAKI;OH HUENG JAE;LEE DAE YOUNG;CHOI JIN WON |
| 分类号 |
B23K3/06 |
主分类号 |
B23K3/06 |
| 代理机构 |
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代理人 |
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