发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION OF THE SAME
摘要 A photosensitive resin composition includes (A) an alkali-soluble resin, (B) a polysiloxane, (C) an ethylenically unsaturated compound, (D) a photo-initiator, (E) a black pigment, and (F) a solvent. The alkali-soluble resin includes an unsaturated-group-containing resin obtained by subjecting a mixture containing (i) an epoxy compound having at least two epoxy groups and (ii) a compound having at least one carboxyl group and at least one ethylenically unsaturated group to polymerization. A weight ratio of the unsaturated-group-containing resin to the polysiloxane ranges from 0.1 to 3.0. Application of the photosensitive resin composition is also disclosed.
申请公布号 US2013135763(A1) 申请公布日期 2013.05.30
申请号 US201213667764 申请日期 2012.11.02
申请人 CHI MEI CORPORATION;CHI MEI CORPORATION 发明人 LIAO HAO-WEI;TSENG CHING-YUAN;LEE CHUN-HSIEN;WU MING-JU;SHIH CHUN-AN
分类号 G03F7/075;G02B5/22 主分类号 G03F7/075
代理机构 代理人
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