发明名称 |
ULTRASOUND PROBE AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>PURPOSE: An ultrasound probe and a manufacturing method thereof are provided to change acoustic impedance in the entire region of a backing layer and to prevent the side lobe of an ultrasonic beam. CONSTITUTION: A backing layer(12) is installed in the rear surface of a piezoelectric layer. A kerf(15) is formed in the front surface of the backing layer in a longitudinal direction. The depth(c) and the width of the kerf have preset values. The depth of the kerf is less than 1 mm. A gap(a) between the kerfs formed on side area is greater than a gap(b) formed on a center part. [Reference numerals] (AA) Gap between kerfs</p> |
申请公布号 |
KR101269459(B1) |
申请公布日期 |
2013.05.30 |
申请号 |
KR20110133372 |
申请日期 |
2011.12.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, DONG HYUN |
分类号 |
A61B8/00;G01N29/24 |
主分类号 |
A61B8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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