发明名称 ULTRASOUND PROBE AND MANUFACTURING METHOD THEREOF
摘要 <p>PURPOSE: An ultrasound probe and a manufacturing method thereof are provided to change acoustic impedance in the entire region of a backing layer and to prevent the side lobe of an ultrasonic beam. CONSTITUTION: A backing layer(12) is installed in the rear surface of a piezoelectric layer. A kerf(15) is formed in the front surface of the backing layer in a longitudinal direction. The depth(c) and the width of the kerf have preset values. The depth of the kerf is less than 1 mm. A gap(a) between the kerfs formed on side area is greater than a gap(b) formed on a center part. [Reference numerals] (AA) Gap between kerfs</p>
申请公布号 KR101269459(B1) 申请公布日期 2013.05.30
申请号 KR20110133372 申请日期 2011.12.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, DONG HYUN
分类号 A61B8/00;G01N29/24 主分类号 A61B8/00
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