| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem in which, while it is easy to manufacture an LED device mounted on a circuit board with an LED die equipped with a phosphor cap, it is not possible to improve a light distribution in a diagonal lower direction even if a size of a circuit board is reduced, and to provide an LED device capable of improving the light distribution in the diagonal lower direction and increasing light flux at the same time when downsizing even if the LED device is equipped with a circuit board and a phosphor cap. <P>SOLUTION: An LED device 10 is formed by flip-chip mounting an LED die 20 on a circuit board 14 and covering the LED die 20 together with the circuit board 14 with a phosphor cap 11. In this case, a planar shape of the circuit board 14 and a planar shape of the LED die 20 are roughly the same. <P>COPYRIGHT: (C)2013,JPO&INPIT |
