| 摘要 |
<P>PROBLEM TO BE SOLVED: To minimize variations in hole diameter caused by heat and improve processing quality, even when the machining path is the shortest. <P>SOLUTION: A laser processing method includes the steps of: dividing a printed wiring board to which a laser beam is scanned into a plurality of scan areas (S1); rearranging the order of perforation in the scan area so that a scanning path distance is the shortest (S2); replacing the order of an N+1-th hole with that of an N+2-th hole when, among the rearranged holes, a distance between an N-th hole and the N+1-th hole (where N is an integer satisfying 1≤N≤maximum number of the holes to be formed-1) is determined to be less than a predetermined threshold and the N+1-th hole is determined not to be the maximum number of the holes to be formed (S3); processing the N-th hole, then stopping the processing only for a predetermined heat radiation time T, and thereafter performing processing when the distance between the N-th hole and the replaced N+1-th hole is determined to be less than the threshold (S4). <P>COPYRIGHT: (C)2013,JPO&INPIT |
