| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an etching solution which controls side etching, improves linearity of copper wiring, and also controls remaining of unetched places; a replenishment solution thereof; and a method for forming copper wiring. <P>SOLUTION: The etching solution is an etching solution for copper and is an aqueous solution including an acid, a cupric ion, an azole compound, and an alicyclic amine compound. The replenishment solution is a replenish solution which is added to the etching solution when the etching solution is continuously or repeatedly used, and is an aqueous solution including an acid, an azole compound, and an alicyclic amine compound. The method for forming copper wiring (1) is a method for etching a part, which is not coated with an etching resist (2), of a copper layer, wherein the etching is performed by using the etching solution. <P>COPYRIGHT: (C)2013,JPO&INPIT |
