发明名称 |
SEMICONDUCTOR CHIP HAVING PLURAL PENETRATING ELECTRODES THAT PENETRATE THERETHROUGH |
摘要 |
Disclosed herein is a semiconductor chip that includes: a semiconductor chip body including a semiconductor substrate and a circuit element layer provided on a main surface of the semiconductor substrate, the circuit element layer including a plurality of circuit elements; first to fourth penetrating electrodes penetrating the semiconductor chip body; a first conductive path electrically connected between the first penetrating electrode and the second penetrating electrode without being in contact with any one of the circuit elements; a second conductive path electrically connected between the first penetrating electrode and the third penetrating electrode without being in contact with any one of the circuit elements; and a third conductive path electrically connected between the second penetrating electrode and the fourth penetrating electrode without being in contact with any one of the circuit elements. |
申请公布号 |
US2013134421(A1) |
申请公布日期 |
2013.05.30 |
申请号 |
US201213688123 |
申请日期 |
2012.11.28 |
申请人 |
ELPIDA MEMORY, INC.;ELPIDA MEMORY, INC. |
发明人 |
TAKAKURA KAZUYA;ISHIKAWA TORU |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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