MICRO SURFACE MOUNT DEVICE PACKAGING

摘要

A variety of improved approaches for packaging integrated circuits are described. In one described approach, a multiplicity of dice (121) are mounted on a carrier (105) (e.g., a plastic carrier). Each die (121) has a plurality of wire bonded contact studs (123) secured to its associated I/O pads. An encapsulant (132) is applied over the carrier to cover the dice and at least portions of the contact studs to form an encapsulant carrier structure. After the encapsulant has been applied, a first surface of the encapsulant and the contact studs are grinded such that exposed portions of the contact studs are smooth and substantially co-planar with the encapsulant. In some embodiments, a redistribution layer (136) is formed over the encapsulant carrier structure and solder bumps (138) are attached to the redistribution layer. A contact encapsulant layer (151) is applied over the encapsulant carrier structure to provide extra mechanical support for the resulting packages.