发明名称 |
FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS |
摘要 |
A microelectronic package can include a substrate having a first surface and a plurality of substrate contacts at the first surface and a microelectronic element having a front surface and contacts arranged within a contact-bearing region of the front surface. The contacts of the microelectronic element can face the substrate contacts and can be joined thereto. An underfill can be disposed between the substrate first surface and the contact-bearing region of the front surface of the microelectronic element. The underfill can reinforce the joints between the contacts and the substrate contacts. A joining material can bond the substrate first surface with the front surface of the microelectronic element. The joining material can have a Young's modulus less than 75% of a Young's modulus of the underfill. |
申请公布号 |
US2013134602(A1) |
申请公布日期 |
2013.05.30 |
申请号 |
US201113307395 |
申请日期 |
2011.11.30 |
申请人 |
SAKUMA KAZUO;MOHAMMED ILYAS;DAMBERG PHILIP;INVENSAS CORPORATION |
发明人 |
SAKUMA KAZUO;MOHAMMED ILYAS;DAMBERG PHILIP |
分类号 |
H01L23/48;H01L21/58;H01L21/60 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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