SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor deice which can appropriately disturb an occurrence of detachment between a heat sink and a mold resin.

SOLUTION: A semiconductor device 1 according to an embodiment comprises: a semiconductor element 2 having a front face and a back face; a front-face-side heat sink 3 positioned on the front face side of the semiconductor element 2 and radiating heat of the semiconductor element 2; a back-face-side heat sink 4 positioned on the back face side of the semiconductor element 2 and radiating heat; and an adjustment member 6 adjusting a clearance between the front-face-side heat sink 3 and the semiconductor element 2 in a planar direction. The semiconductor device 1 further comprises: a sealing material 5 covering the semiconductor device 1 except a front face of the front-face-side heat sink 3 and a back face of the back-face-side heat sink 4. The adjustment member 6 includes a resin layer 61 having a thermal cure shrinkage larger than that of the sealing material 5.

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