发明名称 |
LIGHT EMITTING MODULE, MANUFACTURING METHOD OF THE SAME, AND LAMP FITTING FOR VEHICLE |
摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a highly reliable light emitting module which improves mechanical and chemical strength of a metal wire for supplying power to a semiconductor light emitting element. <P>SOLUTION: A light emitting module LM is equipped with an LED element 23, supplies power by a metal wire 3, and includes: a first resin (a sealing material) 4 sealing the metal wire 3 and a second resin (a dam wall) 5 enclosing at least a part of an outer periphery of the first resin. The first resin 4 has lower viscosity and lower elastic modulus compared to the second resin 5. The first resin 4 mechanically and chemically protects the metal wire 3 and the second resin 5 prevents the first resin 4 from flowing out to the periphery and maintains the sealing state of the metal wire 3 which is formed by the first resin 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013105929(A) |
申请公布日期 |
2013.05.30 |
申请号 |
JP20110249386 |
申请日期 |
2011.11.15 |
申请人 |
KOITO MFG CO LTD |
发明人 |
SUZUKI TETSUYA;MATSUMOTO AKIHIRO;NAKAGAWA TOMOYUKI;SONE NAOKI |
分类号 |
H01L33/56;F21S8/10;F21W101/10;F21Y101/02 |
主分类号 |
H01L33/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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