| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having higher reliability than a semiconductor device in the past by improving adhesion of a connection member to a bonding surface and improving adhesion of a resin for resin encapsulation to the bonding surface. <P>SOLUTION: A semiconductor device comprises: a semiconductor chip 110; a first lead frame 120 for mounting the semiconductor chip 110: and second lead frames 130, 140 having bonding surfaces 132, 142, respectively, in which the bonding surfaces 132, 142 of the second lead frames 130, 140 are electrically connected with the semiconductor chip 110 via connection members 150, and the semiconductor chip 110, the first lead frame 120 and the second lead frames 130, 140 are integrated by resin encapsulation. The bonding surfaces 132, 142 are first rough surfaces roughened by a first roughening treatment and connected with the connection members 150 without plating. <P>COPYRIGHT: (C)2013,JPO&INPIT |
