| 摘要 |
<P>PROBLEM TO BE SOLVED: To adjust an exposure amount for each area set finely in a substrate surface, to improve uniformity of a resist residual film after development processing and to suppress variations in a line width and pitch of a wiring pattern. <P>SOLUTION: An exposure device 1 exposes a pattern of an original plate M on an original plate stage 3 on a substrate G on a substrate stage 2 while performing a synchronous movement of the substrate G and the original plate M. The exposure device 1 includes a local exposure section 20 provided on an upper side of the substrate stage 2 to locally irradiate the substrate G with light, and a control section 40 for controlling a light emission drive of the local exposure section 20. The local exposure section 20 includes a plurality of light emitting elements L which are disposed in a line shape in a substrate width direction and are capable of irradiating the substrate G moved by the substrate stage 2 with light, and a light emission drive section 25 capable of selectively light-emission driving one or a plurality of light emitting elements L as a light emission control unit, among the plurality of light emitting elements L. <P>COPYRIGHT: (C)2013,JPO&INPIT |
