| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the occurrence of solder blow holes without limiting the arrangement flexibility of a wiring pattern and also prevent short circuits caused by solder. <P>SOLUTION: According to one embodiment, a manufacturing method of an electronic component packaging module, to which an electrolytic capacitor 1 having a recessed part is soldered, includes the steps of: inserting a lead wire 1a of the electrolytic capacitor 1 into an insertion hole 11 and mounting the electrolytic capacitor 1 on a mounting region A of a printed wiring board 10; fixing the printed wiring board 10 to a jig plate 20, exposing the insertion hole 11 to an opening 22 of the jig plate 20, and causing a through hole 12 at the mounting region A inner side and a through hole 13 at the mounting region A outer side to communicate with a flow passage part 23 of the jig plate 20 thereby causing the recessed part 1b to communicate with an upper space of the printed wiring board 10; and immersing the jig plate 20 to which the printed wiring board 10 is fixed in a molten solder bath so that a rear surface of the printed wiring board 10, which is exposed to the opening 22, contacts with molten solder. <P>COPYRIGHT: (C)2013,JPO&INPIT |
