发明名称 |
PACKAGED DIE FOR HEAT DISSIPATION AND METHOD THEREFOR |
摘要 |
A heat spreader die holder that covers at least 50% of both major sides of a semiconductor die. The heat spreader die holder includes at least one opening. The heat spreader die holder is attached to a substrate. Electrically conductive structures of the die are electrically coupled to electrically conductive structures of the substrate.
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申请公布号 |
US2013134575(A1) |
申请公布日期 |
2013.05.30 |
申请号 |
US201113307622 |
申请日期 |
2011.11.30 |
申请人 |
YUAN YUAN;CARPENTER BURTON J. |
发明人 |
YUAN YUAN;CARPENTER BURTON J. |
分类号 |
H01L23/34;H01L21/50 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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