发明名称 STAMPING DIE FOR SPLICED BACK PANEL AND PROCESSING METHOD FOR SPLICED BACK PANEL
摘要 <p>A stamping die for a spliced back panel and a processing method for a spliced back panel. The processing method for a spliced back panel includes: placing the sheet materials of a heat dissipation plate (1) and a support plate (2) into the same die for processing; and then splicing and fixing the processed heat dissipation plate (1) and support plate (2). Since the heat dissipation plate (1) and support plate (2) are processed simultaneously on the same die, the processing procedure of two plates can be combined, shortening the processing steps by a half. In addition, when being processed within the same die simultaneously, the consistency of two plates is good, and the flatness is better when being spliced.</p>
申请公布号 WO2013075353(A1) 申请公布日期 2013.05.30
申请号 WO2011CN83336 申请日期 2011.12.02
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.;KUO, YI-CHENG;ZHOU, GEGE 发明人 KUO, YI-CHENG;ZHOU, GEGE
分类号 G02F1/13;B23P15/24 主分类号 G02F1/13
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