| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device for inspecting a semiconductor device which detects emission from a semiconductor device while heating it. <P>SOLUTION: In an inspection device 1, an observation stage 16 mounting a semiconductor chip 2 is manufactured from Si which is the same material as a substrate material of the semiconductor chip 2, and an imaging element 35 is arranged in the rear face side of the semiconductor chip 2. Weak light which has been generated in the semiconductor chip 2 transmits through the semiconductor chip 2 and the observation stage 16, and is incident on the imaging element 35. The observation stage 16 is manufactured from the Si, and accordingly can be easily heated by a heater 25. A probe card 19 and an LSI tester 20 are arranged above the observation stage 16, which enable a test of a circuit of the semiconductor chip 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
