发明名称 |
SEMICONDUCTOR STRUCTURE COMPRISING MOISTURE BARRIER AND CONDUCTIVE REDISTRIBUTION LAYER |
摘要 |
A semiconductor structure includes semiconductor devices on a substrate, a moisture barrier on the substrate surrounding the semiconductor devices, and a metal conductive redistribution layer formed over the moisture barrier. The metal conductive redistribution layer and the moisture barrier define a closed compartment containing the semiconductor devices.
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申请公布号 |
US2013134560(A1) |
申请公布日期 |
2013.05.30 |
申请号 |
US201113306708 |
申请日期 |
2011.11.29 |
申请人 |
WHOLEY JAMES;PARKHURST RAY MYRON;MAPLE MARSHALL;AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD. |
发明人 |
WHOLEY JAMES;PARKHURST RAY MYRON;MAPLE MARSHALL |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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