发明名称 SEMICONDUCTOR STRUCTURE COMPRISING MOISTURE BARRIER AND CONDUCTIVE REDISTRIBUTION LAYER
摘要 A semiconductor structure includes semiconductor devices on a substrate, a moisture barrier on the substrate surrounding the semiconductor devices, and a metal conductive redistribution layer formed over the moisture barrier. The metal conductive redistribution layer and the moisture barrier define a closed compartment containing the semiconductor devices.
申请公布号 US2013134560(A1) 申请公布日期 2013.05.30
申请号 US201113306708 申请日期 2011.11.29
申请人 WHOLEY JAMES;PARKHURST RAY MYRON;MAPLE MARSHALL;AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD. 发明人 WHOLEY JAMES;PARKHURST RAY MYRON;MAPLE MARSHALL
分类号 H01L23/02 主分类号 H01L23/02
代理机构 代理人
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