| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad that is excellent in heat resistance and water resistance while having high local planarization performance, a high polishing rate, and small variations in polishing rate because of the excellent heat resistance and water resistance. <P>SOLUTION: The polishing pad is formed by using polyurethane comprising polyol and an isocyanate. The polyurethane is configured so that the polyol contains a glycol unit having an ethylene glycol unit and at least one kind of a side chain, and the ethylene glycol unit in the polyol is 0.1-10 wt.% of the total weight of the polyol. <P>COPYRIGHT: (C)2013,JPO&INPIT |
