| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability while keeping a cavity shape of a hollow package, in a semiconductor device including the hollow package. <P>SOLUTION: The resin composition is used in a resin member 10 of a semiconductor device 100, and contains a thermosetting resin, a solvent and a photocurable resin. When the solvent is dried, and the resin composition is exposed with light having a wavelength of 365 nm so that the integrated quantity of light becomes 700 mJ/cm<SP POS="POST">2</SP>with respect to a thickness of 50 μm and is photo-cured, and then viscoelasticity is measured under conditions of a temperature of 150°C and a frequency of 1 Hz, the storage elastic modulus is 100 Pa or more 10,000 Pa or less and tanδ is 0.1 or more. <P>COPYRIGHT: (C)2013,JPO&INPIT |
