发明名称 JOINING METHOD AND JUNCTION MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a joining method capable of firmly and efficiently joining two base materials with high dimensional accuracy, and a junction material joined by the joining method. <P>SOLUTION: A joining method comprises the steps of: forming a monomolecular film 31 having a first functional group on a first base material 21 by a chemical vapor phase deposition method which uses a coupling agent having the first functional group; forming a monomolecular film 32 having a second functional group on a second base material 22 by a chemical vapor phase deposition method which uses a coupling agent having the second functional group reacting with the first functional group; and obtaining a junction material 1 in which the first base material 21 and the second base material 22 are joined via the monomolecular film 31 and the monomolecular film 32 by pressurizing and heating the first base material 21 and the second base material 22 in a state in which the first base material 21 and the second base material 22 are superimposed so that the monomolecular film 31 and the monomolecular film 32 face with each other. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013105803(A) 申请公布日期 2013.05.30
申请号 JP20110247146 申请日期 2011.11.11
申请人 SEIKO EPSON CORP 发明人 OTSUKA KENJI
分类号 H01L21/02 主分类号 H01L21/02
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