| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper alloy for electronic equipment having high yield strength and excellent bendability and suitable for parts for electronic equipment such as a terminal, a connector, a relay, and a lead frame, and to provide a method for producing a copper alloy for electronic equipment, a copper alloy plastic working material for electronic equipment, and parts for electronic equipment. <P>SOLUTION: The copper alloy for electronic equipment includes Mg in an amount of 3.3 atom% or more and 6.9 atom% or less, and further contains one or two or more of at least Pd and Ag each in an amount of 0.1 atom% or more and 5.0 atom% or less, with the balance being substantially Cu and inevitable impurities. In the scanning electron microscope observation of the alloy, the average number of intermetallic compounds essentially comprising Cu and Mg having a particle size of 0.1 μm or more is 1/μm<SP POS="POST">2</SP>or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
