发明名称 ANTI-INTERFERENCE COVER MADE OF A COMPOUND MATERIAL FOR AN ELECTRONIC PRODUCT
摘要 An anti-interference cover made of a compound material for an electronic product has a fiber fabric. The fiber fabric is made of a compound material to take the form of a case, and has at least one unblocking area, each one of the at least one unblocking area having multiple non-conductive fibers interwoven and aligned longitudinally and transversely, and multiple conductive fibers interwoven and aligned longitudinally and transversely and not covered by the at least one unblocking area. When the cover is assembled with an electronic product, the at least one unblocking area of the cover allows electromagnetic wave transmitted and received by communication components to pass therethrough, thereby preventing blocking signals and providing a cover with high strength, thin profile and light weight.
申请公布号 US2013137327(A1) 申请公布日期 2013.05.30
申请号 US201113304452 申请日期 2011.11.25
申请人 TSENG KAI-HSI 发明人 TSENG KAI-HSI
分类号 D03D15/00;B32B15/02;B32B17/02 主分类号 D03D15/00
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