| 摘要 |
A chip-package includes a chip-carrier configured to carry a chip, the chip arranged over a chip-carrier side, wherein the chip-carrier side is configured in electrical connection with a chip back side; an insulation material including: a first insulation portion formed over a first chip lateral side; a second insulation portion formed over a second chip lateral side, wherein the first chip lateral side and the second chip lateral side each abuts opposite edges of the chip back side; and a third insulation portion formed over at least part of a chip front side, the chip front side including one or more electrical contacts formed within the chip front side; wherein at least part of the first insulation portion is arranged over the chip-carrier side and wherein the first insulation portion is configured to extend in a direction perpendicular to the first chip lateral side further than the chip-carrier.
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