IMPROVED APPARATUS AND METHOD OF BONDING SUBSTRATES

摘要

PURPOSE: An improved substrate bonding device and a bonding method thereof are provided to prevent the occurrence of air or a foreign substance between a lower substrate and an upper substrate. CONSTITUTION: Bonding solution(430) is sprayed within a closed boundary seal line(422). When an upper substrate(410) and a lower substrate(420) are compressed by a roller(421), the closed boundary seal line is operated as a barrier. The bonding solution is uniformly compressed between the upper substrate and the lower substrate within the closed boundary seal line. The upper substrate and the lower substrate are strongly compressed by generating a uniform compression force in the upper substrate and the lower substrate.