Multilevel microelectronic package with internal shielding

摘要

The box has an intermediate structure (12) installed on lower and upper stages (13, 11) and comprising metallic channels. Microelectronic printed circuits of the stages (11, 13) and the structure are made up of organic material. The channels are interconnected with connection points of the circuits of the stages (11, 13) such that the stages (11, 13) are interconnected during assembling of the box.