Method and device for producing thin silicon rods

摘要

Producing thin silicon rods, comprises (a) providing a rod (1) of silicon, (b) sequentially cutting slabs having a particular thickness from the rod by a sawing device, where the rod is respectively rotated axially through 90[deg] or 180[deg] between two successive cuts such that four successive cuts are formed and two of the four cuts respectively take place pairwise on radially opposite sides of the rod or the cutting of the slabs takes place simultaneously together at radially opposite sides of the rod, and (c) sawing the cut slabs into thin rods having a rectangular cross section. Producing thin silicon rods, comprises (a) providing a rod (1) of silicon, (b) sequentially cutting slabs having a particular thickness from the rod by a sawing device, where the rod is respectively rotated axially through 90[deg] or 180[deg] between two successive cuts such that four successive cuts are formed and two of the four cuts respectively take place pairwise on radially opposite sides of the rod or the cutting of the slabs takes place simultaneously together at radially opposite sides of the rod, and (c) sawing the cut slabs into thin rods having a rectangular cross section; or (a1) providing a rod of silicon, (b1) producing many vertical cuts over a total length of the rod by a first sawing device, where the cuts are mutually separated, and a spacing of the cuts and a cutting depth are formed according to a desired edge length of a thin rod with a rectangular cross section to be produced, and (c1) producing a horizontal cut in a longitudinal direction of the rod by a second sawing device to separate thin rods having a rectangular cross section from the rod, where the steps (b1) and (c1) are sequentially carried out several times in succession and the rod is respectively rotated axially through 90[deg] or 180[deg] between two successive cuts according to the step (c1) to form four successive cuts and two of the four cuts respectively take place pairwise on radially opposite sides of the rod. An independent claim is also included for device for producing thin rods from a silicon rod by sawing, comprising a first unit comprising many cutting tools and a cooling liquid (6) for cooling the cutting tools, a second unit comprising nozzles for introducing additional cooling liquid into cutting splits of a workpiece to be processed, and a third unit comprising a band saw, a wire saw or cutting tool containing at least one shaft (3).