| 摘要 |
PURPOSE: A substrate panel and a manufacturing method thereof are provided to produce a semiconductor package having a high degree of matching by manufacturing a substrate unit reducing the generation of height differences. CONSTITUTION: A substrate unit(110) is a part where a circuit is formed and generates and controls electric signals, and includes insulation layers(111,113,115) and conduction layers(112,114,116) capable of being formed on the insulation layers with a circuit pattern. A dummy region(130) surrounds multiple substrate units. A reinforcement layer(120) is inserted into the dummy region in order to prevent drooping of a solder resist(140) covering the substrate unit and the dummy region. The solder resist is laminated while covering the conduction layers and the reinforcement layer at the same time in order to protect a circuit pattern formed on the substrate unit with the conduction layers.
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