LAMINATION DEVICE AND LAMINATION METHOD

摘要

PURPOSE: A laminating method and a laminating apparatus are provided to laminate a film-shaped laminate on an object with a uniform thickness without a void. CONSTITUTION: A heating unit(1,2) heats an insulating resin film. A top board(3) and a bottom board(4) are installed to be opened or closed. A support member(5) has elasticity to face the polymerized insulating resin film. An elastic rod(6) faces a semiconductor wafer with the polymerized insulating resin film. A vacuum absorption unit(7) absorbs the inside of a chamber in a vacuum state. A pressurizing unit(8) pressurizes the semiconductor wafer and the insulating resin film.