发明名称 SEGMENTED GRINDING WHEEL AND METHOD OF MANUFACTURING SAME
摘要 <p>It is intended that the expansion and contraction of a disc-like core do not impose a compression stress or the like on adhesives situated between adjoining segmented chips. A plurality of segmented chips 11 are reinforced by applying an adhesive 20 to the circumferentially opposite end portions thereof, and the adjoining segmented chips adjoining in the circumferential direction are adhered to the circumferential surface 21a of a disc-like core 21 with the adhesives at the circumferentially opposite end portions being not jointed with each other. Thus, the segmented chips can be prevented from being loaded with an unnatural force even when the disc-like core with the segmented chips adhered thereto expands and contracts radially due to thermal expansion and thermal contract.</p>
申请公布号 EP1974863(B1) 申请公布日期 2013.05.29
申请号 EP20060832561 申请日期 2006.11.13
申请人 TOYODA VAN MOPPES LTD.;JTEKT CORPORATION 发明人 KITAJIMA, MASATO;UNNO, KUNIHIKO;TAKEHARA, HIROSHI;KONO, TAKUMA;SOMA, SHINJI
分类号 B24D5/08;B24D3/14;B24D5/12 主分类号 B24D5/08
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