MANUFACTURING METHOD OF PROBE SUBSTRATE

摘要

PURPOSE: A method for manufacturing a probe substrate is provided to improve adhesion between a circuit pattern and a substrate by preventing an undercut in the circuit pattern. CONSTITUTION: A substrate is provided(110). A seed layer is formed on one side of the substrate(120). A metal layer is formed on the seed layer(130). A circuit pattern is formed on the substrate by removing a part of the seed layer and the metal layer(140). [Reference numerals] (110) Provide a substrate; (120) Form a seed layer; (130) Form a metal layer; (140) Form a pattern by using laser; (AA) Start; (BB) End