PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve wetting between solder and a surface-treated layer and to reduce bump defects by forming a copper layer through electroplating on a bump pad when forming a fine pitch bump. CONSTITUTION: A printed circuit board(100) includes a base substrate(110), a circuit layer, a solder resist layer(130), a metal layer(140), and a surface-treated layer(150). The solder resist layer functions as a protection layer for the outermost layer circuit and is formed for electrical insulation. The metal layer is formed at an open part(131) of the solder resist layer and reduces an aspect ratio by filling the space of the open part.