发明名称 MIXED ALLOY SOLDER PASTE
摘要 A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.
申请公布号 KR20130056235(A) 申请公布日期 2013.05.29
申请号 KR20127028941 申请日期 2011.04.04
申请人 INDIUM CORPORATION 发明人 ZHANG HONGWEN;LEE NING CHENG
分类号 B23K35/26;B23K35/02;B23K35/362 主分类号 B23K35/26
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