发明名称 Component mounting apparatus
摘要 A component mounting apparatus includes: two heads equipped with plural nozzles for suctioning and mounting a component; a memory holding at least one of information on maximum speed and maximum acceleration; an operation determining unit determining whether an operation after a suctioning operation of any one of heads is a suctioning operation or not; a speed/acceleration calculating unit calculating at least one of speed and acceleration at the time of axial movement by using at least one of the maximum speed and the maximum acceleration for the suction, if it is determined that the operation after the suctioning operation is the suctioning operation; a control signal generating unit generating a control signal; and a driving unit performing movement from the suction operation to a component suction position of the subsequent nozzle in accordance with the control signal when the suctioning operation by the subsequent nozzle is performed.
申请公布号 US8448331(B2) 申请公布日期 2013.05.28
申请号 US201113159583 申请日期 2011.06.14
申请人 BABA HIROSHI;SONY CORPORATION 发明人 BABA HIROSHI
分类号 B23P19/00 主分类号 B23P19/00
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