Socket connector having contact with multiple beams jointly grasping ball of IC package

摘要

A socket connector is provided to receive an IC package having an array of conductive balls thereunder. The socket connector includes an insulative housing defining a plurality of receiving holes and a plurality of contacts received in the receiving holes respectively. Each contact includes a bottom plate and at least two contacting beams extending upwardly from the bottom plate and jointly defining a receiving space for the ball of the IC package. At least one contacting beam has a sharp blade facing toward the receiving space so as to engage the ball when the IC package is mounted on the housing.