发明名称 |
Integrated circuit device with semiconductor device components embedded in plastic housing composition |
摘要 |
The invention relates to a semiconductor device comprising semiconductor device components embedded in plastic housing composition. The semiconductor device components partly contain copper or have copper-containing coatings and/or coating structures. The copper-containing regions of the semiconductor device components have an adhesion promoting layer with copper(II) oxide whiskers on the surfaces that are in contact with the plastic housing composition.
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申请公布号 |
US8450861(B2) |
申请公布日期 |
2013.05.28 |
申请号 |
US20070747585 |
申请日期 |
2007.05.11 |
申请人 |
OTREMBA RALF;INFINEON TECHNOLOGIES AG |
发明人 |
OTREMBA RALF |
分类号 |
H01L23/29 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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