发明名称 |
Semiconductor component and method of manufacture |
摘要 |
A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes stacked semiconductor die. In accordance with embodiments, the semiconductor component includes a substrate having a component receiving area and a plurality of bond pads. A semiconductor chip is attached to the component receiving area. An electrical connector is coupled to the semiconductor chip and the substrate. A second semiconductor chip is mounted or attached to one of the ends of the electrical connector such that this end is positioned between the semiconductor chips. A second electrical connector is coupled between the second semiconductor chip and the substrate. A third semiconductor chip is mounted over or attached to the second electrical connector such that a portion is between the second and third semiconductor chips. |
申请公布号 |
US8451621(B2) |
申请公布日期 |
2013.05.28 |
申请号 |
US20100948970 |
申请日期 |
2010.11.18 |
申请人 |
KRISHNAN SHUTESH;WANG SOON WEI;SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
KRISHNAN SHUTESH;WANG SOON WEI |
分类号 |
H05K7/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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