| 摘要 |
Methods of compounding nanoparticles (e.g., surface-modified silica nanoparticles) with a resin (e.g., a curable resin) are described. The methods use continuous wet milling technology and can be used to compound nanoparticles, including highly aggregated and agglomerated surface-modified nanoparticles, into a resin or resin precursor.
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