| 摘要 |
According to one embodiment, an electronic apparatus includes a housing, a wiring pattern, a recess, a pad portion, and an electronic component. The wiring pattern is formed on an inner surface of the housing from an electrically conductive adhesive. The recess is in the inner surface of the housing. The pad portion is formed in the recess from the conductive adhesive and connected to an end portion of the wiring pattern. The electronic component includes a terminal which contacts the pad portion.
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