| 摘要 |
<p>PURPOSE: An epoxy resin composition for sealing a semiconductor is provided to have excellent continuous moldability and reliability under high temperature and humidity. CONSTITUTION: An epoxy resin composition for sealing a semiconductor comprises an epoxy resin, phenol resin, a curing accelerator, inorganic filler, and a hydrotalcite compound, and a carboxylic acid-containing wax with acidity of 10-100 mg KOH/g. The epoxy resin is an epoxy resin with a biphenyl group. The wax is a mixture of oxidation polyethylene and long-chain aliphatic acid. Each of the hydrotalcite compound and wax is 0.02-2.0 wt% with regard to the epoxy resin composition.</p> |
