发明名称 Methods for enhancing photolithography patterning
摘要 A method for fabricating a semiconductor device that includes: providing a substrate prepared with a photoresist layer; providing a photomask comprising a first and a second pattern having a respective first and second pitch range; providing a composite aperture comprising a first and a second off-axis illumination aperture pattern, the first off-axis aperture pattern having a configuration that improves the process window of the first pitch range and the second off-axis aperture pattern having a configuration that improves the process window for a second pitch range; exposing the photoresist layer on the substrate with radiation from an exposure source through the composite aperture and the photomask; and developing the photoresist layer to pattern the photoresist layer.
申请公布号 US8450046(B2) 申请公布日期 2013.05.28
申请号 US20090392093 申请日期 2009.02.24
申请人 LING MOH LUNG;CHUA GEK SOON;LIN QUNYING;TAY CHO JUI;QUAN CHENGGEN;GLOBALFOUNDRIES SINGAPORE PTE. LTD.;NATIONAL UNIVERSITY OF SINGAPORE 发明人 LING MOH LUNG;CHUA GEK SOON;LIN QUNYING;TAY CHO JUI;QUAN CHENGGEN
分类号 G03F7/30;G03B27/72 主分类号 G03F7/30
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