| 摘要 |
A semiconductor module (1,2,3,4) includes a semiconductor device (10); a metal plate portion (50, 501, 502) that includes a first surface (50c) on a side of the semiconductor device and has a fastening portion (52,521,522) at an end thereof; a molded portion (60) that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion (57, 573) that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins (57a, 573a) on a side opposite to the side of the metal plate portion; wherein the fastening portion (52,521,522) of the metal plate portion (50, 501, 502) is exposed out of the molded portion, and the cooling plate portion includes a fastening portion (58) at a position (57, 573) that corresponds to a position of the fastening portion of the metal plate portion. |
