PHOTOCURING TYPE ADHESIVE OR PRESSURE-SENSITIVE ADHESIVE FILM FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE, ORGANIC ELECTRONIC DEVICE AND PREPARING METHOD THEREOF

摘要

PURPOSE: A photocurable adhesive film for encapsulating an organic electronic device, the organic electronic device, and an encapsulating method thereof are provided to easily prevent moisture by a thermocurable operation after a crosslink is formed by irradiating light. CONSTITUTION: An organic light emitting device is located on the upper side of a substrate. An adhesive film encapsulates the front side of the organic light emitting device on the substrate. The adhesive film includes an adhesive layer with a photocurable material of a photocurable adhesive composition. The photocurable adhesive composition includes acryl based polymer, epoxy resin, and a cation photopolymerization initiator. A wafer vapor transmission rate of the adhesive film is below 150 g/m^2day. [Reference numerals] (AA,BB,DD) Adhesive bonding material; (CC,EE) Element