Method for manufacturing wiring board and method for manufacturing inkjet printhead substrate

摘要

A method for manufacturing a wiring board includes a first process of preparing a substrate having a hole passing through a first surface and a second surface opposite the first surface; a second process of closing the opening of the hole in the first surface with a wiring member; a third process of supplying a powder conductive material onto the second surface to fill the hole with the conductive material; a fourth process of removing the conductive material that is not charged into the hole from the top of the second surface; and a fifth process of melting the conductive material that fills the hole by heating the conductive material and thereafter solidifying the conductive material.