发明名称 |
Printed circuit board with reinforced thermoplastic resin layer |
摘要 |
A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.
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申请公布号 |
US8450618(B2) |
申请公布日期 |
2013.05.28 |
申请号 |
US201113137656 |
申请日期 |
2011.08.31 |
申请人 |
SOHN KEUNG-JIN;SHIN JOON-SIK;RYU JOUNG-GUL;PARK JUNG-HWAN;PARK HO-SIK;LEE SANG-YOUP;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SOHN KEUNG-JIN;SHIN JOON-SIK;RYU JOUNG-GUL;PARK JUNG-HWAN;PARK HO-SIK;LEE SANG-YOUP |
分类号 |
H05K1/03;H05K1/09 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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