| 摘要 |
A semiconductor device includes: a semiconductor element (1) having an internal circuit (17); and electrode pads (22, 22, . . . ) provided for the semiconductor element (1). The electrode pads (22, 22, . . . ) are electrically connected to the internal circuit (17) via control portions (31) for controlling electrical connection between the electrode pads (22, 22, . . . ) and the internal circuit (17).
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